SiC Wafer Manufacturer

As a SiC Wafer Manufacturer in semiconductor manufacturing, HMT specializes in producing premium-grade SiC substrates across multiple diameters - from 2" to industry-standard 8" wafers - maintaining cost-efficiency without compromising on crystalline perfection.

Our comprehensive product portfolio features:
• D/R/P Class substrates optimized for diverse industrial applications
• As-cut SiC Wafers for grinding and polishing testing
• Custom-SiC boules tailored to unique specifications
• Multi-layer SiC epitaxial solutions for next-gen power devices

Even customization, customers can still get preferential price of SiC Wafers, As Cut SiC Wafers or SiC Boules. 

SiC Wafer Applications


The newest 8 inch SiC Wafer                            Different Dimension SiC Wafers
 

SiC material has a wide band gap, high breakdown electric field, high thermal conductivity, high electron mobility and radiation resistance characteristics, SiC based SBD and MOSFET is more suitable for high-frequency, high temperature, high pressure, high power and radiation resistance in the environment.  Under the condition of the same power level, the use of SiC devices can reduce the volume of electric drive, electronic control, etc., to meet the demand of higher power density, more compact design, but also can make the electric vehicle longer range.  On the one hand, SiC power components are gradually mature in terms of technology, on the other hand, the trend of intelligent and electrification continues to evolve, and the upgrade of downstream traditional vehicles brings huge demand for power semiconductor, so there is a wide space for replacing SiC power devices.