6 inch SiC Wafer Supplier For SiC Finishing Parts

As a leading SiC wafer manufacturer based in Suzhou, China, HMT specializes in producing high-performance 6 inch as-cut SiC wafers for diverse industrial applications like SiC Finishing Parts,SiC Processing Parts For IC/Chip Bonding. We provide a wide range of thickness options, including ultra-thick unpolished wafers (1600μm, 1300μm, 900μm, etc.), designed to meet the stringent requirements of semiconductor companies and R&D laboratories worldwide.  

Why Choose HMT SiC Wafers?

1.Custom Thickness & Precision: From thin substrates to robust 1600μm wafers, our as-cut products ensure minimal material loss and superior structural integrity.  

2.6-Inch SiC Wafer Expertise: Beyond 2/4inch solutions, HMT is a trusted 6-inch 8-inch SiC wafer supplier for SiC finishing parts, supporting advanced semiconductor manufacturing processes.  

3.Fast Global Delivery: Streamlined logistics guarantee timely shipments to domestic and international clients.  

4.Cost-Effective Quality: Competitive pricing without compromising on industry-leading flatness standards.  

Serving Innovation Across Industries 

HMT partners with global semiconductor leaders and research institutions, delivering SiC substrates  that power next-gen devices in power electronics, optoelectronics, and quantum computing. Our dual capabilities as both a SiC wafer manufacturer and 6-inch supplier position us as a one-stop solution for prototyping to mass production.  

Request a Quote Today

Elevate your semiconductor projects with HMT's expertise. Contact us to discuss specifications for 2-inch as-cut wafers  or 6-inch SiC finishing parts – where innovation meets reliability.