SiC Substrate Wafer Manufacturer碳化硅衬底片晶片厂家, 4H-N/4H-SI SiC Substrate Wafer Manufacturer 4H-N/4H-SI碳化硅衬底片生产厂家

6 inch SiC Wafer Supplier For SiC Finishing Parts

Diameter: 150mm
Type: Conductive N type
Thickness: 400~1600um
Package: Cassette
SiC Wafer Solutions 2025 SiC Substrate Application

Grade: D/R/P Grade
Type: 4H-HPSI/4H-N
Dimension：2inch 4inch 6inch 8inch
Thickness：350±25um/500±25um
4 inch P Grade SiC Substrate Manufacturer SiC VS Silicon Advantages

Grade: D/R/P Grade
Type: 4H-HPSI/4H-N
Dimension：2inch 4inch 6inch 8inch
Thickness：350±25um/500±25um
AR Lenses HPSI SiC Substrate Manufacturer

Grade: D/P Grade
Type: 4H-HPSI
Dimension：4inch 6inch 8inch
Thickness：500±25um
4 Inch SiC Ingots/SiC Boule

Diameter: 100±0.25mm
Thickness: Min ＞15mm
Type: 4H-N or 4H-SI
Grade: D Grade / P Grade
6 inch SiC Boule/ Ingot Manufacturer

Diameter: 150±0.2mm
Thickness: Min ＞15mm
Type: 4H-N or 4H-SI
Grade: D Grade / P Grade
6 inch SiC Boule Manufacturer

Diameter: 150±0.25mm
Thickness: Min ＞15mm
Type: 4H-N or 4H-SI
Grade: D Grade R Grade P Grade
N Type Conductive SiC Boule

Diameter: 100mm/150mm
Thickness:10~15mm
Type: 4H-N Conductive
Grade: D Grade / P Grade
4＆6英寸碳化硅晶棒晶锭

长度：Min ≥15mm
等级：测试D级/产品P级
类型：导电N型/半绝缘SI型
直径：100±0.25mm/150±0.2mm
导电型＆半绝缘型碳化硅晶锭晶棒

长度：Min ≥15mm
尺寸：4英寸及6英寸
类型：导电N型/半绝缘SI型
包装：单晶锭密封包装
SiC Ingot Manufacturer For Laser Cutting

Diameter: 100mm 150mm
Thickness: Min ＞15mm
Type: 4H-N or 4H-SI
Grade: D Grade / P Grade
SiC Wafer Manufacturer

Type: 4H-N
Dimension: 2 inch 4 inch 6 inch 8 inch
Grade: D R P
Product Name: SiC Substrate
8 inch D Grade SiC Wafer Manufacturer

Type: 4H-N
Diameter：8inch / 6inch
Grade: Production / Dummy
Product Name: SiC Wafer
P Grade 8 inch SiC Wafer Manufacturer

Type: 4H-N
Diameter：200mm
Grade: Production
Product Name: SiC Wafer
SiC Substrate Manufacturer

Type: 4H-N
Grade: D R P
Thickness: 350um±25um
Dimension: 2 inch~8 inch
4H-N 8 inch SiC Substrate Manufacturer

Type: 4H-N
Diameter：200mm
Grade: Mechanical
Product Name: SiC Substrate

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