Custom 2"-8" As-Cut N-Type 4H-SiC Wafers

As a specialized SiC As-Cut Wafer manufacturer, HMT engineers premium Raw-Cut silicon carbide wafers (2", 4", 6", 8") for critical power electronics and SiC processing parts applications. Our proprietary processing technology ensures unmatched structural stability in thick-wafer formats while maintaining crystalline perfection.

Core Manufacturing Capabilities:
⚙️ Advanced Wafer Slicing

• Diamond-wire cutting with <0.5μm surface roughness

• Substrate warpage guaranteed

• Zero microcrack guarantee up to 1100μm thickness
  
  

⚙️ Material Expertise

• Exclusive focus on conductive N-Type 4H-SiC polytype

• Micropipe density: <0.5/cm² (2''/4"/6")

• Resistivity control: 0.015–0.028 Ω·cm
   

⚙️ Bespoke Thickness Solutions

• Standard: 350μm - 500μm

• Heavy-Duty Options: 600μm | 800μm | 900μm | 1100μm+

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Why Engineers Choose HMT:
✅ 8" Wafer Leadership: Highest yielding 200mm substrates in Asia
✅ Breakage-Risk Elimination: Patented handling for ultra-thick wafers
✅ Delivery Worldwide: Submit specs → Receive wafers by FedEx Air express.

Applications Engineered for Reliability:
• EV traction inverters (≥800V systems)
• Industrial DC-AC converters
• High-power RF amplifiers
• Next-gen solar microinverters