Product Description
As the high quanlity un-polished SiC wafer manufacturer and supplier in the semiconductor market, HMT company can supply As-cut SiC Wafer for lapping and polishing machines testing. we provide 4 inch and 6 inch un-polished SiC wafer both for N type and semi-insulating type. The thickness of raw cut SiC wafer is about 440um,600um,1000um etc. Please contact us for detailed thickness and specicication.
Silicon carbide is a wide band gap semiconductor material, also known as the third generation of semiconductor materials, compared with the first and second generation of semiconductor materials, silicon carbide has a large band gap width, high breakdown field strength, high thermal conductivity, electronic saturation drift rate and other performance advantages.
HMT SiC Wafer Without Lapping Pictures and Package
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