SiC Ingot Manufacturer For Laser Cutting

Find a high-quality manufacturer and supplier of 6-inch SiC ingots from China. HMT company, as the leading manufacturer of SiC ingots, supplies both 4H-N and 4H-SI type SiC ingots for laser cutting applications. We offer both 4-inch and 6-inch SiC ingots at competitive prices at the market. If you are interested in testing your laser cutting equipment, please contact us now.



The production process of SiC wafers can be summarized into key steps such as cutting, grinding, polishing and cleaning. In this series of processes, the damage degree and roughness of the material surface are strictly controlled. Cutting is the first step in the preparation of SiC, and its processing quality is directly related to the subsequent grinding and polishing process, which has a profound impact on the performance of the final chip. At present, in industrial manufacturing, SiC wafers mainly use multi-wire cutting method.Wire saw cutting technology has become the main means to prepare wafers, this method than the traditional single saw cutting technology has a significant improvement, its biggest advantage is that it can handle multiple wafers at the same time.